Proceedings of the PVP Conference covering topics such as codes and standards, and design and analysis, related to pressure vessel and piping technologies for the power and process industries. Printed collection on 81 full-length, peer-reviewed technical papers. Topics include: Materials & Fabrication.
Advanced Metallization Conference 2006Â¿held in Tokyo and San Diego, CaliforniaÂ¿highlights both current state-of-the Âart and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on Â¿Nanostructured Materials for InterconnectsÂ¿ is featured. 2007, hardcover, 97 papers, 693 pages.
From the UN Security Council and the European Union's Council of Ministers to obscure committees on food labelling or the scheduling of World Fairs, several thousand multilateral conferences are held each year. Why do governments deploy so much effort in these activities? What goes on behind the scenes at these meetings? How are their outcomes determined and what are the real-world consequences? Ronald A. Walker reveals the inner workings of such conferences, the result-oriented strategies that are pursued behind a facade of formal ritual and their impact on the behavior of sovereign states.
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